Rigid-Flex PCB – Technical specification
| Feature | Technical specification |
| Number of layers | 4-16 layers |
| Technology highlights | Mixed materials including RF and high speed, standard FR-4, polyimide flex. Adhesiveless or adhesive based polyimide flex constructions, with cover coat or flexible solder mask materials. |
| Bending performance | Based on the specific design, the bend performance can range from a basic 90 °bend to fit to a full dynamic flex with 360° range of motion in the flex tail that will withstand continuous cycles throughout the product life. |
| Bend features | Bend radius controls the flexibility of the flex portion of the board. The thinner the material the lower the bend radius and the more flexible the flex section. |
| Materials | RA copper, HTE copper, FR-4, polyimide, adhesive |
| Copper weights (finished) | ½ ounce, 1 ounce, 2 ounce, 3 ounce |
| Minimum track and gap | 0.075mm / 0.075mm |
| PCB thickness | 0.4mm to 3mm |
| PCB thickness in flex section | 0.05mm to 0.8mm |
| Maxmimum dimensions | 457mm to 610mm |
| Surface finishes available | ENIG, OSP Immersion tin, Immersion silver |
| Minimum mechanical drill | 0.20mm |
Available structures for rigid flex PCBs
There are numerous, different structures available. The more common ones are defined below:
Traditional rigid flex construction (IPC-6013 type 4) Multilayer rigid and flexible circuit combination containing three or more layers with plated through holes. Capability is 22L with 10L flex layers.
Asymmetrical rigid flex construction, where the FPC is situated on the outer layer of the rigid construction. Containing three or more layers with plated through holes.
Multilayer rigid flex construction with buried / blind via (microvia) as part of the rigid construction. 2 layers of microvia are achievable. Construction may also include two rigid structures as part of a homogeneous build. Capability is 2+n+2 HDI structure.
Rigid Flexible PCB that we made:
Rigid Flexible PCB Manufacture Quality Control:
1. Engineering pretreatment before production
2. 100% E-test, 100% visual inspection
3. AOI inspection
4. High voltage test, impedance control test
5. Micro section, soldering capacity, thermal, shocking test
6. Reliability test, insulating resistance test, ionic cleanliness testing
Shenzhen Yideyi Technology Co., Ltd is an ISO 9001 and ISO14000 certified manufacturer and exporter that is concerned with the design, development and production of Electrical & Electronic products, including the plastic mould design and production. With a modern building and harmonious working place, all of the procedures and systems in order designed for the critical standards.
FAQ:
Q1. How to keep our product information and design file secret ?
We are willing to sign a NDA effect by customers side local law and promising to keep customers data in high confidential level.
Q2. What file formats do you accept for production?
Gerber file: CAM350 RS274X
PCB file: Protel 99SE, P-CAD 2001 PCB
BOM: Excel (PDF,word,txt)
Q3. What’s the MOQ?
We are able to handle Small as well as large volume production with flexibility.
Q4. How can we guarantee you receive an good quality product?
For PCB, we will use Flying Probe Test, E-test etc. for it.
For PCBA, we need you to offer us a method or test fixture for the function test.Before that, our inspectors will use microscope and X-ray to check the IC footwelding or bad solder etc.
